| Author | Search for: Chen, J.1; Search for: Hojjati, M.1 |
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| Affiliation | - National Research Council of Canada. NRC Institute for Aerospace Research
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| Format | Text, Article |
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| Conference | 24th Annual Technical Conference of the American Society for Composites 2009 and 1st Joint Canadian-American Technical Conference on Composites, September 15-17, 2009, Newark, DE USA |
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| Subject | curing kinetics; dielectric cure monitoring; epoxy resin |
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| Abstract | In this study, the cure behavior of the Cycom RTM 890 resin system was characterized using differential scanning calorimetry (DSC) and an on-line dielectric cure monitoring technique. Isothermal DSC measurements were conducted at five different temperatures: 120°C, 140°C, 160°C, 180°C and 200 °C. Results from the isothermal DSC measurement were used to establish a cure kinetic model for the epoxy resin system. Also, the ionic conductivity measured by a dielectric sensor under three isothermal temperatures was correlated to the DSC results. The degree of the cure of the resin system predicted by the kinetics model was compared with that obtained by DSC and by dielectric cure monitoring. |
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| Publication date | 2009 |
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| Publisher | Current Associates |
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| In | |
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| Language | English |
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| Peer reviewed | Yes |
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| NPARC number | 23004573 |
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| Export citation | Export as RIS |
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| Report a correction | Report a correction (opens in a new tab) |
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| Record identifier | 0b76c871-fdbd-4921-bf94-009275a4fa57 |
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| Record created | 2018-11-21 |
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| Record modified | 2020-04-16 |
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