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Interaction of parallel dielectric cracks in functionally graded piezoelectric materials

From National Research Council Canada

DOIResolve DOI: https://doi.org/10.1007/s00707-009-0229-5
AuthorSearch for: ; Search for: ORCID identifier: https://orcid.org/0009-0008-0777-7919
FormatText, Article
Subjectstress intensity factor; piezoelectric material; crack model; material gradient; parallel crack
Abstract
In this paper, the problem of two interacting parallel cracks in functionally graded piezoelectric materials under in-plane electromechanical loads is studied. The formulation is based on using Fourier transforms and modeling the cracks as distributed dislocations, and the resulting singular integral equations are solved with Chebyshev polynomials. A dielectric crack model considering the crack filling effect is adopted to describe the electric boundary conditions along crack surfaces. Numerical simulations are made to show the effect of material gradient, the geometry of interacting cracks, and crack position upon fracture parameters such as stress intensity factors, electric displacement intensity factor, and COD intensity factor. By considering the effect of a dielectric medium inside the crack and crack deformation, the results obtained from the dielectric crack model are always between those from the traditional crack models with physical limitation.
Publication date
PublisherSpringer
In
  • Acta Mechanica 211, no. 3-4 (10 September 2009): 251–269.
LanguageEnglish
Peer reviewedYes
NRC publication
This is a non-NRC publication

"Non-NRC publications" are publications authored by NRC employees prior to their employment by NRC.

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Record created2024-12-13
Record modified2024-12-13
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