Fully automated hot embossing processes utilizing high resolution working stamps
Fully automated hot embossing processes utilizing high resolution working stamps
DOI | Resolve DOI: https://doi.org/10.1016/j.mee.2009.11.098 |
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Author | Search for: Glinsner, T.; Search for: Veres, T.1; Search for: Kreindl, E.; Search for: Morton, K.1; Search for: Wieser, T.; Search for: Thanner, C.; Search for: Treiblmayr, D.; Search for: Miller, R.; Search for: Lindner, P. |
Name affiliation |
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Format | Text, Article |
Journal title | Microelectronic Engineering |
ISSN | 0167-9317 1873-5568 |
Volume | 87 |
Pages | 1037–1040 |
Subject | hot embossing; soft working stamps; de-embossing; spin-on layer; high resolution |
Abstract | |
Publication date | 2009-11-24 |
Publisher | Elsevier |
Language | English |
Peer reviewed | Yes |
NPARC number | 23002043 |
Export citation | Export as RIS |
Report a correction | Report a correction |
Record identifier | 40c53f07-bc23-4a48-9d1e-bf6ce6176d07 |
Record created | 2017-07-27 |
Record modified | 2020-04-16 |