Thermal expansion coefficient measurement from electron diffraction of amorphous films in a TEM

From National Research Council Canada

DOIResolve DOI: https://doi.org/10.1016/j.ultramic.2018.02.003
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Name affiliation
  1. National Research Council of Canada. Nanotechnology
FormatText, Article
Journal titleUltramicroscopy
ISSN0304-3991
1879-2723
Volume188
Pages8–12
Abstract
We measured the linear thermal expansion coefficients of amorphous 5–30 nm thick SiN and 17 nm thick Formvar/Carbon (F/C) films using electron diffraction in a transmission electron microscope. Positive thermal expansion coefficient (TEC) was observed in SiN but negative coefficients in the F/C films. In case of amorphous carbon (aC) films, we could not measure TEC because the diffraction radii required several hours to stabilize at a fixed temperature.
Publication date
PublisherElsevier
LanguageEnglish
Peer reviewedYes
NPARC number23002830
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Record identifier6d816a79-9d25-4897-8f88-71d8cb436176
Record created2018-03-08
Record modified2020-03-16
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