Download | - View accepted manuscript: Copper immersion deposition on magnesium alloy: the effect of fluoride and temperature (PDF, 2.7 MiB)
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DOI | Resolve DOI: https://doi.org/10.1149/1.1923728 |
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Author | Search for: Yang, Lianxi1; Search for: Luan, Ben1 |
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Affiliation | - National Research Council of Canada. NRC Industrial Materials Institute
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Format | Text, Article |
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Subject | copper; magnesium alloys; electric impedance; x-ray photoelectron spectra; scanned electron microscopy; electroless deposition; corrosion protective coatings |
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Abstract | A study was carried out to examine copper immersion deposition on AZ91 magnesium alloy in a hydrofluoric acid-containing bath. The role of fluoride and the effect of bath temperature were investigated. The study was performed by measuring the ac impedance and open-circuit potentials in combination with X-ray photoelectron spectroscopy and scanning electron microscopy surface analysis. Results showed that the effect of both HF concentration and temperature on copper immersion deposition is significant, via affecting the surface film formation on the magnesium surface. A model for understanding the copper immersion deposition process is depicted based on surface characterization and the electrochemical measurements. |
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Publication date | 2005 |
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In | |
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Language | English |
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Peer reviewed | Yes |
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NPARC number | 21272543 |
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Export citation | Export as RIS |
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Report a correction | Report a correction (opens in a new tab) |
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Record identifier | 7997ba7b-b33c-40c6-81be-87b2bdbe0370 |
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Record created | 2014-12-02 |
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Record modified | 2020-06-04 |
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