Microstructure characterization of TLP bonded IN617 alloy
Microstructure characterization of TLP bonded IN617 alloy
Author | Search for: 1; Search for: 2; Search for: 2 |
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Affiliation |
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Format | Text, Article |
Conference | Symposium on Materials Science and Technology 2005, MS&T 2005 From 9/25/2005 To 9/28/2005., Pittsburgh, PA, USA |
Subject | Joining of Superalloys; IN 617; TLP bonding |
Access condition |
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Peer reviewed | Yes |
NRC number | AMTC-2006-0111 |
NPARC number | 8931017 |
Export citation | Export as RIS |
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Record identifier | 86c5ff77-1f3c-4f17-b8f5-77be81472b7d |
Record created | 2009-04-23 |
Record modified | 2020-04-17 |
- Date modified: