| DOI | Resolve DOI: https://doi.org/10.1016/j.photonics.2010.12.002 |
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| Author | Search for: Shishodia, M.S.; Search for: Jayaweera, P.V.V.; Search for: Matsik, S.G.; Search for: Perera, A.G.U.; Search for: Liu, H.C.1; Search for: Buchanan, M.1 |
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| Affiliation | - National Research Council of Canada
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| Format | Text, Article |
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| Subject | Absorption peaks; Corrugated surfaces; Design and optimization; Experimental investigations; Free carrier absorption; GaAs-based structures; Heterojunction interfacial workfunction internal photoemission; IR absorption; IR detector; Metal interactions; Optical absorption; Responsivity; Surface Plasmon; Surface plasmon excitation; Surface plasmons; Corrugated metal; Detectors; Heterojunctions; Infrared absorption; Light absorption; Metals; Optoelectronic devices; Photodetectors; Plasmons; Absorption |
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| Abstract | Metal corrugated surfaces have the potential of enhancing optical absorption through surface plasmon (SP) excitation facilitated by light-metal interactions. The successful utilization of metal corrugation induced optical absorption can improve the response of free carrier absorption (FCA), based HEterojunction Interfacial Workfunction Internal Photoemission (HEIWIP) detectors. This article reports theoretical and experimental investigations of SP-induced infrared (IR) absorption in GaAs based structures, exhibiting absorption peak wavelength (λ p) in the 10-14 μm region. Moreover, substantial absorption and responsivity improvement using metallic corrugation on typical heterojunction detector is predicted. Proposed design and optimization approaches will be useful for improving the performance of IR detectors. © 2011 Elsevier B.V. All rights reserved. |
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| Publication date | 2011 |
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| In | |
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| Language | English |
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| Peer reviewed | Yes |
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| NPARC number | 21271756 |
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| Export citation | Export as RIS |
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| Report a correction | Report a correction (opens in a new tab) |
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| Record identifier | 8dee7831-e2c9-4ef6-81ad-16b7a8487cd0 |
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| Record created | 2014-03-24 |
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| Record modified | 2020-04-21 |
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