Simulating charged defects in silicon dangling bond logic systems to evaluate logic robustness

DOIResolve DOI: https://doi.org/10.1109/TNANO.2024.3372946
AuthorSearch for: ORCID identifier: https://orcid.org/0000-0001-8061-3074; Search for: ORCID identifier: https://orcid.org/0000-0001-9164-1556; Search for: ORCID identifier: https://orcid.org/0000-0001-5660-9518; Search for: ORCID identifier: https://orcid.org/0000-0002-4993-7860; Search for: ORCID identifier: https://orcid.org/0000-0001-7850-0548; Search for: ORCID identifier: https://orcid.org/0000-0002-3639-6858
FunderSearch for: Natural Sciences and Engineering Research Council of Canada
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PublisherInstitute of Electrical and Electronics Engineers
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LanguageEnglish
Peer reviewedYes
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"Non-NRC publications" are publications authored by NRC employees prior to their employment by NRC.

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Record identifierc20e4745-ce1b-4ddc-8a92-d564edeecf32
Record created2026-01-23
Record modified2026-02-25

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