DOI | Resolve DOI: https://doi.org/10.1364/OE.23.022628 |
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Author | Search for: Benedikovic, Daniel; Search for: Cheben, Pavel1ORCID identifier: https://orcid.org/0000-0003-4232-9130; Search for: Schmid, Jens H.1; Search for: Xu, Dan-Xia1; Search for: Lamontagne, Boris1; Search for: Wang, Shurui1; Search for: Lapointe, Jean1; Search for: Halir, Robert; Search for: Ortega-Moñux, Alejandro; Search for: Janz, Siegfried1; Search for: Dado, Milan |
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Name affiliation | - National Research Council of Canada. Information and Communication Technologies
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Format | Text, Article |
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Journal title | Optics Express |
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ISSN | 1094-4087 |
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Volume | 23 |
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Issue | 17 |
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Pages | 22628–22635 |
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Subject | efficiency; optical fibers; photonic devices; photonic integration technology; refractive index; engineered surfaces; fiber chip coupling; fundamental component; photonic integrated circuits; silicon on insulator waveguide; silicon-on- insulators (SOI); single etch process; surface grating couplers; silicon on insulator technology |
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Abstract | Surface grating couplers are fundamental components in chip-based photonic devices to couple light between photonic integrated circuits and optical fibers. In this work, we report on a grating coupler with sub-decibel experimental coupling efficiency using a single etch process in a standard 220-nm silicon-on-insulator (SOI) platform. We specifically demonstrate a subwavelength metamaterial refractive index engineered nanostructure with backside metal reflector, with the measured peak fiber-chip coupling efficiency of -0.69 dB (85.3%) and 3 dB bandwidth of 60 nm. This is the highest coupling efficiency hitherto experimentally achieved for a surface grating coupler implemented in 220-nm SOI platform. |
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Publication date | 2015-08-19 |
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Publisher | The Optical Society |
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Language | English |
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Peer reviewed | Yes |
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NPARC number | 21277379 |
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Export citation | Export as RIS |
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Report a correction | Report a correction |
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Record identifier | e2f01bd7-e863-4d77-b50c-f8f8f9bdc747 | Record created | 2016-03-09 |
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Record modified | 2020-04-22 |
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