The Fourth International Conference on 3-D Digital Imaging and Modeling (3DIM), October 6-10, 2003, Banff, Alberta, Canada
A description of the integrated sensors developed for flying-spot active triangulation will be given. All the sensors have been fabricated using standard CMOS technology that allows the monolithic integration of photo-sensors, together with readout circuits, and digital signal processors. Position sensors are classified into two classes that allow a better understanding of the pros and cons of each one. A description of the proposed position sensor that is optimized for accurate and fast 3D acquisition is given alongside some experimental results.
Proceedings of the Fourth International Conference on 3-D Digital Imaging and Modeling (3DIM).