Impact of high-resolution regional climate conditions on the moisture performance of wood-frame building envelopes

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DOIResolve DOI: https://doi.org/10.23967/c.dbmc.2023.083
AuthorSearch for: ORCID identifier: https://orcid.org/0000-0002-7224-9740; Search for: 1ORCID identifier: https://orcid.org/0000-0002-6529-1123; Search for: ORCID identifier: https://orcid.org/0000-0002-7112-8584; Search for: 1ORCID identifier: https://orcid.org/0000-0001-9212-6599; Search for: 1ORCID identifier: https://orcid.org/0000-0002-0141-6054; Search for: ORCID identifier: https://orcid.org/0000-0003-1368-4301; Search for: 1ORCID identifier: https://orcid.org/0000-0001-7640-3701
Affiliation
  1. National Research Council of Canada. Construction
FormatText, Article
ConferenceXVI International Conference on Durability of Building Materials and Components (DBMC 2023), October 10-13, 2023, Beijing, China
Physical description8 p.
Subjecthigh-resolution regional climate conditions; moisture performance; wood-frame wall assemblies; hygrothermal simulation
Abstract
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PublisherCIMNE
SCIPEDIA
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In
LanguageEnglish
Peer reviewedYes
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Record identifierfb470f3c-5269-4c1b-a995-6b81fde5a61e
Record created2024-03-26
Record modified2024-04-15
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