| Résumé | A new approach to reduce the decomposition of electroless Ni–P deposition solution during coating of 3003 aluminum alloy was verified. This new approach uses an immersion coated Cu layer to protect the subsequent electroless deposition solution from being contaminated by the dissolution of substrate. Water rinsing of pretreated 3003 Al substrate prior to immersion coating was, however, found to have an effect on the subsequent immersion coating process, and a new rinsing process with significant beneficial effect was developed. AFM and SEM were used to observe the effect under different conditions. XPS was applied to study the surface changes so as to understand the effect. Successful rinsing yielded satisfactory immersion copper coating, which was, in turn, found beneficial to the stability of the subsequent electroless deposition bath. |
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