Téléchargement | - Voir le manuscrit accepté : Numerical modeling of hot embossing process for manufacturing of microcomponents (PDF, 4.1 Mio)
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Auteur | Rechercher : Kabanemi, K. K.1; Rechercher : Marcotte, J. P.1; Rechercher : Hétu, J. F.1; Rechercher : Worgull, M.; Rechercher : Heckele, M. |
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Affiliation | - Conseil national de recherches du Canada. Institut des matériaux industriels du CNRC
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Format | Texte, Article |
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Résumé | Hot embossing is a compression molding technique used for high replication accuracy of small features. One of the most sensitive phases of the process is the de-embossing stage during which the patterned part has to be demolded. In this paper, the demolding stage is considered as a frictional contact problem between a rigid mold insert and a viscoelastic polymer sheet as it deforms and cools inside a mold under an applied force. The contact is modeled with a modified Coulomb's law of dry friction while a generalized Maxwell model is used to describe the polymer behavior during embossing, cooling and de-embossing stages. The heat transfer between the mold insert and the patterned polymer sheet is solved through a domain decomposition method. A finite element approximation based on a penalized technique is proposed and analyzed. The purpose of this modeling approach is to predict dimensional stability and residual shape of microcomponenets in the hot embossing process. Such a prediction will allow one to assign appropriate processing conditions that minimize geometrical imperfections and increase replication accuracy. |
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Date de publication | 2007-01-01 |
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Dans | |
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Langue | anglais |
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Publications évaluées par des pairs | Oui |
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Numéro du CNRC | NRCC 50596 |
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Numéro NPARC | 15859842 |
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Exporter la notice | Exporter en format RIS |
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Signaler une correction | Signaler une correction (s'ouvre dans un nouvel onglet) |
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Identificateur de l’enregistrement | 5aecf7d4-aea1-43a7-a234-15b125621a2a |
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Enregistrement créé | 2010-07-30 |
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Enregistrement modifié | 2020-05-10 |
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