| DOI | Trouver le DOI : https://doi.org/10.2514/6.2012-1725 |
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| Auteur | Rechercher : Ashrafi, Behnam1; Rechercher : Jakubinek, Michael B.2; Rechercher : Martinez-Rubi, Yadienka2; Rechercher : Simard, Benoit2; Rechercher : Johnston, Andrew1 |
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| Affiliation | - Conseil national de recherches du Canada. Aérospatiale
- Conseil national de recherches du Canada. Technologies de sécurité et de rupture
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| Format | Texte, Article |
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| Conférence | 53rd AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference 2012, April 23-26, 2012, Honolulu, Hawaii |
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| Sujet | Electrical conductivity; Electrical resistances; Interlaminar fracture toughness; Interlaminar properties; Mechanical and electrical; Mechanical and electrical properties; Mechanical performance; Mode-i fracture toughness; Aluminum; Epoxy resins; Fracture toughness; Resins; Structural dynamics; Electric conductivity |
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| Résumé | In this work, the influence of SWCNTs on electrical and mechanical performance of two epoxy resins was studied. In the first study, a small quantity of SWCNTs (0.125 wt%) was incorporated into a high-temperature aerospace-grade epoxy. After the modification with SWCNTs, the correlation between bulk properties of this epoxy (electrical conductivity and Mode I fracture toughness) and the properties of epoxy/glass fiber laminates (inplane/ transverse electrical conductivity and Mode I interlaminar fracture toughness) was investigated. It was found that the electrical property improvements of nano-modified laminates exceeded those of bulk SWCNT-modified epoxy. On the other hand, the fracture toughness improvement of bulk epoxy after the addition of SWCNTs did not translate into interlaminar properties enhancement, possibly due to reduction of the nano-modified resin's ability to interact with glass fiber mats. In the second study, the mechanical and electrical performance of a SWCNT-modified epoxy adhesive was studied for aluminum-to-aluminum bonding. It was found that the integration of 1 wt% SWCNTs can considerably improve joint Mode I fracture toughness by ~ 35% due to mechanisms such as crack bridging. The electrical resistance of the bondline was also consistent with the electrical conductivity of SWCNT-modified adhesive films (~10-3 S/m), but somewhat lower than the bulk electrical conductivity measured on thicker samples. © 2012 by Canada National Research Council. |
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| Date de publication | 2012-04 |
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| Langue | anglais |
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| Publications évaluées par des pairs | Oui |
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| Numéro NPARC | 21270014 |
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| Exporter la notice | Exporter en format RIS |
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| Signaler une correction | Signaler une correction (s'ouvre dans un nouvel onglet) |
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| Identificateur de l’enregistrement | 769fe6ed-22fb-4a2c-b4f0-015472a66d7a |
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| Enregistrement créé | 2013-12-13 |
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| Enregistrement modifié | 2020-04-21 |
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