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Advanced applications of metal–organic decomposition inks in printed electronics

Par Conseil national de recherches du Canada

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DOITrouver le DOI : https://doi.org/10.1021/acsaelm.3c00910
AuteurRechercher : ; Rechercher : ; Rechercher : 1; Rechercher : Identifiant ORCID : https://orcid.org/0000-0002-9863-7039; Rechercher : Identifiant ORCID : https://orcid.org/0000-0002-9344-8810
Affiliation
  1. Conseil national de recherches du Canada. Technologies de sécurité et de rupture
FormatTexte, Article
Sujetprinted electronics; additive manufacturing; metal−organic decomposition inks; molecular inks; electronic applications; sintering techniques
Résumé
Technology-based industries are constantly seeking materials and methods to fabricate compact, high-performance, and increasingly more complex printed electronic devices, fostering research in advanced conductive inks and processing techniques. Metal–organic decomposition (MOD) inks are a class of conductive inks based on molecular metal precursors that decompose into metallic features once printed, imparting them with unique attributes that distinguish them from particle-based inks. This Spotlight on Applications summarizes recent progress in understanding the chemistry, rheology, and printability of MOD inks that enable them to be printed, processed, and used with material substrates in unconventional ways. Their unique properties and capabilities are being leveraged to advance the field of printed electronics, from their use in 2.5D and 3D surfaces, wearables, and fine line printing and thus broadening the form factors and improving properties of devices used in the medial, automotive and aerospace industries.
Date de publication
Maison d’éditionAmerican Chemical Society
Licence
Dans
  • ACS Applied Electronic Materials 6, nº 1 (22 décembre 2023) : 1–23.
Langueanglais
Publications évaluées par des pairsOui
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Identificateur de l’enregistrementf9c8ad38-7697-461e-8b52-43c864621b2b
Enregistrement créé2024-04-15
Enregistrement modifié2024-04-15
Date de modification :