| Download | - View accepted manuscript: An electrochemical approach to total organic carbon control in printed circuit board copper sulfate plating baths Part II: Overfall system (PDF, 789 KiB)
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| Author | Search for: Gattrell, M.1; Search for: MacDougall, B.1; Search for: Henuset, Y. M.2; Search for: Fournier, J.2 |
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| Affiliation | - National Research Council of Canada. NRC Institute for Chemical Process and Environmental Technology
- National Research Council of Canada. NRC Industrial Materials Institute
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| Format | Text, Article |
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| Subject | electgrooxidation; membrane selectivity; plating bath purification |
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| Abstract | An electrochemical system for oxidative removal of high levels of total organic carbon (TOC) in printed circuit board (PCB) copper sulfate plating baths has been developed. These organic contaminants build-up over the course of pattern plating of PCBs, and at high concentrations they interfere with the quality of the plated copper. The chemistry of the electrochemical oxidation of the plating bath contaminants was qualitatively followed using high performance liquid chromatography (HPLC) and chemical oxygen demand (COD) measurements. A complete treatment system is described and rough calculations are given showing, for a given set of conditions, how the proper choice of electrode material and current density can minimize the system cost. |
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| Publication date | 2002 |
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| In | |
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| Language | English |
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| Peer reviewed | Yes |
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| NRC number | NRCC 52295 |
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| NPARC number | 16293128 |
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| Export citation | Export as RIS |
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| Report a correction | Report a correction (opens in a new tab) |
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| Record identifier | 25a04b1d-64d1-4394-b151-7684571aea96 |
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| Record created | 2010-11-01 |
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| Record modified | 2020-03-30 |
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