The influence of processing parameters on TLP joining of Inconel 617 alloy
The influence of processing parameters on TLP joining of Inconel 617 alloy
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Affiliation |
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Format | Text, Article |
Conference | Second International Symposium on Aerospace Materials: Development, Testing and Life Cycle Issues - Honoring William Wallace, COM 2004, pp.263-274, Aug. 22-25, 2004 From 08/22/2004 To 08/25/2004., Hamilton / Canada |
Subject | Inconel 617; Transient liquid phase bonding; microstructure control |
Access condition |
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Peer reviewed | Yes |
NRC number | AMTC-2005-0047 |
NPARC number | 8930202 |
Export citation | Export as RIS |
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Record identifier | 5f22b33b-bb1a-4385-b0f3-d891a3854fd6 |
Record created | 2009-04-23 |
Record modified | 2020-04-16 |
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