A new approach to modeling the cure kinetics of epoxy/amine thermosetting resins. 2. Application to a typical system based on bis[4-(diglycidylamino)phenyl]methane and bis(4-aminophenyl) sulfone

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DOIResolve DOI: https://doi.org/10.1021/ma00011a012
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  1. National Research Council of Canada. NRC Industrial Materials Institute
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PublisherAmerican Chemical Society
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LanguageEnglish
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NRC numberCNRC 31698
NRC-IGM90AP-32004-1028-G
NPARC number23003993
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Record identifier7b54d765-52b1-4e33-bd84-e08028aec153
Record created2018-09-11
Record modified2020-05-30
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