A new approach to modeling the cure kinetics of epoxy/amine thermosetting resins. 2. Application to a typical system based on bis[4-(diglycidylamino)phenyl]methane and bis(4-aminophenyl) sulfone
A new approach to modeling the cure kinetics of epoxy/amine thermosetting resins. 2. Application to a typical system based on bis[4-(diglycidylamino)phenyl]methane and bis(4-aminophenyl) sulfone
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DOI | Resolve DOI: https://doi.org/10.1021/ma00011a012 |
Author | Search for: 1; Search for: 1; Search for: 1 |
Affiliation |
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Format | Text, Article |
Abstract | |
Publication date | 1991-05-01 |
Publisher | American Chemical Society |
In | |
Language | English |
Peer reviewed | Yes |
NRC number | CNRC 31698 NRC-IGM90AP-32004-1028-G |
NPARC number | 23003993 |
Export citation | Export as RIS |
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Record identifier | 7b54d765-52b1-4e33-bd84-e08028aec153 |
Record created | 2018-09-11 |
Record modified | 2020-05-30 |
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