Thermal analysis of above-grade wall assembly with low emissivity materials and furred-airspace
Thermal analysis of above-grade wall assembly with low emissivity materials and furred-airspace
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DOI | Resolve DOI: https://doi.org/10.1016/j.buildenv.2011.01.009 |
Author | Search for: 1; Search for: 1; Search for: 1; Search for: 1 |
Affiliation |
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Format | Text, Article |
Subject | 3D modeling, low emissivity material, air space, thermal resistance, wood-frame walls; Building envelope |
Abstract | |
Publication date | 2011-01-09 |
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Language | English |
Peer reviewed | Yes |
NRC number | NRCC 53584 NRC-IRC-21267 |
NPARC number | 20374013 |
Export citation | Export as RIS |
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Record identifier | 7db273c0-5a9d-4f02-b078-f4457e428aa9 |
Record created | 2012-07-23 |
Record modified | 2020-04-21 |
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