Experimental Study to Reduce Residual Stresses in Bonded Patch Repair - ABSTRACT ONLY
Experimental Study to Reduce Residual Stresses in Bonded Patch Repair - ABSTRACT ONLY
Author | Search for: 1; Search for: 1; Search for: 1 |
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Affiliation |
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Format | Text, Article |
Conference | 36th International SAMPE Technical Conference From 11/15/2004 To 11/18/2004, San Diego / USA |
Subject | Bonded repair; residual stresses |
Access condition |
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Peer reviewed | Yes |
NRC number | SMPL-2004-0098 |
NPARC number | 8927631 |
Export citation | Export as RIS |
Report a correction | Report a correction (opens in a new tab) |
Record identifier | 9444808b-aa3c-42c4-b84c-46d07e71ae70 |
Record created | 2009-04-23 |
Record modified | 2020-04-16 |
- Date modified: