Experimental Study to Reduce Residual Stresses in Bonded Patch Repair - ABSTRACT ONLY
Experimental Study to Reduce Residual Stresses in Bonded Patch Repair - ABSTRACT ONLY
| Author | Search for: 1; Search for: 1; Search for: 1 |
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| Affiliation |
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| Format | Text, Article |
| Conference | 36th International SAMPE Technical Conference From 11/15/2004 To 11/18/2004, San Diego / USA |
| Subject | Bonded repair; residual stresses |
| Access condition |
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| Peer reviewed | Yes |
| NRC number | SMPL-2004-0098 |
| NPARC number | 8927631 |
| Export citation | Export as RIS |
| Report a correction | Report a correction (opens in a new tab) |
| Record identifier | 9444808b-aa3c-42c4-b84c-46d07e71ae70 |
| Record created | 2009-04-23 |
| Record modified | 2020-04-16 |
- Date modified: