| DOI | Resolve DOI: https://doi.org/10.1109/CEIDP.2009.5377780 |
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| Author | Search for: Bulinski, A.1; Search for: Bamji, S. S.1; Search for: Abou-Dakka, M.1; Search for: Chen, Y.1 |
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| Affiliation | - National Research Council of Canada. NRC Institute for National Measurement Standards
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| Format | Text, Article |
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| Conference | 2009 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), October 18-21, 2009, Virginia Beach, VA, USA |
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| Abstract | The incorporation of synthetic silica nanoparticles into polypropylene is shown to increase the ac breakdown strength compared to unfilled material. This breakdown strength stays unchanged during application of a 40 kV/mm dc field for up to 500 h at both, room temperature and 90°C. Dielectric spectroscopy shows an increase of dielectric loss factor, tan¿, with nanoflller concentration and a distinct relaxation around 60°C. The increase of tan¿ caused by nanoparticles is moderate and thus manageable in practical applications. Subjecting specimens to a dc field did not significantly change the dielectric loss spectra. The dc conductivity of the materials with nano-filler was found to be higher than for unfilled materials. This is believed to be caused by the overlapping of the diffuse double layers surrounding nanoparticles, which provide a path for the migration of electric charge. Aging nanocomposites in a dc field resulted in the increase of conductivity but the increments were significantly smaller than those observed in the material without organoclay. |
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| Publication date | 2010-01-12 |
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| Publisher | IEEE |
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| In | |
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| Language | English |
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| Peer reviewed | Yes |
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| NPARC number | 23004716 |
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| Export citation | Export as RIS |
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| Report a correction | Report a correction (opens in a new tab) |
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| Record identifier | c9410211-582e-4700-9d1e-39c54d24d04f |
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| Record created | 2018-12-12 |
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| Record modified | 2020-04-17 |
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