| DOI | Trouver le DOI : https://doi.org/10.1109/CEIDP.2009.5377780 |
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| Auteur | Rechercher : Bulinski, A.1; Rechercher : Bamji, S. S.1; Rechercher : Abou-Dakka, M.1; Rechercher : Chen, Y.1 |
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| Affiliation | - Conseil national de recherches du Canada. Institut des étalons nationaux de mesure du CNRC
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| Format | Texte, Article |
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| Conférence | 2009 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), October 18-21, 2009, Virginia Beach, VA, USA |
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| Résumé | The incorporation of synthetic silica nanoparticles into polypropylene is shown to increase the ac breakdown strength compared to unfilled material. This breakdown strength stays unchanged during application of a 40 kV/mm dc field for up to 500 h at both, room temperature and 90°C. Dielectric spectroscopy shows an increase of dielectric loss factor, tan¿, with nanoflller concentration and a distinct relaxation around 60°C. The increase of tan¿ caused by nanoparticles is moderate and thus manageable in practical applications. Subjecting specimens to a dc field did not significantly change the dielectric loss spectra. The dc conductivity of the materials with nano-filler was found to be higher than for unfilled materials. This is believed to be caused by the overlapping of the diffuse double layers surrounding nanoparticles, which provide a path for the migration of electric charge. Aging nanocomposites in a dc field resulted in the increase of conductivity but the increments were significantly smaller than those observed in the material without organoclay. |
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| Date de publication | 2010-01-12 |
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| Maison d’édition | IEEE |
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| Dans | |
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| Langue | anglais |
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| Publications évaluées par des pairs | Oui |
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| Numéro NPARC | 23004716 |
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| Exporter la notice | Exporter en format RIS |
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| Signaler une correction | Signaler une correction (s'ouvre dans un nouvel onglet) |
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| Identificateur de l’enregistrement | c9410211-582e-4700-9d1e-39c54d24d04f |
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| Enregistrement créé | 2018-12-12 |
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| Enregistrement modifié | 2020-04-17 |
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