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Effect of voltage level on the performance of silicone rubber in the inclined plane tracking and erosion test

Par Conseil national de recherches du Canada

DOITrouver le DOI : https://doi.org/10.1109/CEIDP55452.2022.9985319
AuteurRechercher : 1; Rechercher : 2; Rechercher : 1; Rechercher : 3; Rechercher : 3; Rechercher : 4
Affiliation
  1. University of Waterloo. Computer Engineering Department
  2. Conseil national de recherches du Canada. Centre de recherche en métrologie
  3. Qatar University.Center for Advanced Materials
  4. Texas A&M University at Qatar. Chemical Engineering Program
Bailleur de fondsRechercher : Qatar National Research Fund
FormatTexte, Article
Conférence2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), October 30 - November 2, 2022, Denver, Colorado, United States
Sujetdegradation; silicon compounds; resistance; insulation; systematics; voltage; high-voltage techniques; alumina; arcs (electric); erosion; filled polymers; insulation testing; insulator testing; polymer insulators; silicon compounds; silicone rubber
Résumé
This paper investigates the effect of the test voltage level on the performance of silicone rubber in inclined plane tracking and erosion test. Silicone rubber composites, filled with either alumina tri-hydrate or ground silica to 30 wt% or 50 wt%, are tested in inclined plane tracking and erosion test under 2.5 kV, 3.5 kV, and 4.5 kV. The degradation patterns of the tested silicone rubber surfaces are found dependent on the test voltage level during the inclined plane tracking and erosion test, as the dry-band arcing on silicone rubber tends to form tracks under relatively mild test voltages and deep erosion under the critical test voltage. These findings confirm the importance of employing the critical voltage while evaluating the erosion resistance of silicone rubber in the inclined plane tracking and erosion test. In addition, the critical test voltage of silicone rubber is found dependent on the amount of filler added to the composite.
Date de publication
Maison d’éditionIEEE
Dans
  • 2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), 9985319 (30 octobre 2022) : 515–518.
Langueanglais
Publications évaluées par des pairsOui
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Identificateur de l’enregistrementb46a4a78-c768-42ca-a695-107557d5ac7b
Enregistrement créé2023-06-30
Enregistrement modifié2023-06-30
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